About Company
At Boeing, we innovate and collaborate to make the world a better place. The Boeing India Engineering & Technology Center (BIETC) in Bengaluru is a powerhouse of over 5,500 engineers shaping the future of aerospace through R&D in AI/ML, IIoT, and Additive Manufacturing. We are looking for a Lead Electronics Packaging Design & Analysis Engineer to take on a hands-on technical leadership role within a growing business unit..
Job Details
| Role: | Lead Electro Mechanical Packaging Design & Analysis Engineer |
| Salary: | UP to ₹35 LPA* |
| Location: | Bengaluru |
| Job Type: | fulltime |
| Posted Date: | 07/02/2026 |
| Application Deadline: | Apply Soon |
Job Description
The Lead Electro-Mechanical Packaging Engineer is the structural “guardian” of aerospace electronics. In this role, you aren’t just designing a box; you are ensuring that sensitive avionics can survive the extreme vibrations of takeoff, the freezing temperatures of high altitude, and the intense heat generated by high-power processors. You sit exactly at the intersection of Mechanical Physics and Electrical Engineering, making high-stakes decisions on materials and cooling strategies that affect flight safety.
Requirements
- Required Skills & Experience:
- Education: Bachelor’s degree in Engineering (Mechanical preferred) with 12+ years of experience, or a Master’s with 11+ years.
- Product Expertise: Strong background in new product design and development for Electronic LRUs.
- Analytical Skills: Deep understanding of GD&T, thermal management, and fastener selection.
- Aerospace Standards: Experience conducting DO-160 Qualification testing and preparing technical documentation (RAC, Qual Plans, etc.).
- Collaboration: Proven ability to work with multi-disciplinary teams (Electrical, Systems, Manufacturing) in a global environment.
- Preferred Skills:
- Hands-on experience in Heat Sink Design, Fan selection, and Thermal Interface Material (TIM) selection.
- Experience in DFM/DFA (Design for Manufacturing/Assembly) for machined and sheet metal components.
- Background in Root Cause Analysis (RCA) and production support..
Roles and Responsibilities
- Technical Leadership: Lead mechanical design and development for complex electro-mechanical Line Replaceable Units (LRUs) and components.
- Conceptual Design: Develop chassis, enclosure, and PCB mount concepts that balance system requirements, weight, cost, and thermal constraints.
- Project Management: Execute end-to-end management, including configuration control, change management, and technical planning aligned with production milestones.
- Production Support: Act as the primary mechanical engineering liaison for issue resolution during production, engaging stakeholders for proactive problem-solving.
- Requirements & Analysis: Analyze customer requirements to perform design calculations, stack-up analysis, and validation of thermal/structural simulations.
- Standards & Testing: Ensure compliance with ARINC, VITA, and DO-160 standards. Conduct qualification testing for thermal, structural, and environmental conditions.
- Mentorship: Provide technical guidance and training to the engineering team while representing the department in Integrated Product Teams (IPTs).
How to Apply?
Role Summary
The Lead Electro-Mechanical Packaging Engineer is the structural “guardian” of aerospace electronics. In this role, you aren’t just designing a box; you are ensuring that sensitive avionics can survive the extreme vibrations of takeoff, the freezing temperatures of high altitude, and the intense heat generated by high-power processors. You sit exactly at the intersection of Mechanical Physics and Electrical Engineering, making high-stakes decisions on materials and cooling strategies that affect flight safety.
Company Culture & Insights
Boeing BIETC in Bengaluru is one of Boeing’s largest engineering sites outside the US. The culture is a blend of high-rigor aerospace standards and modern tech-hub innovation. Because you are working on flight hardware, the environment is “safety-first” and highly documented. However, Boeing is heavily investing in Model-Based Engineering, meaning you’ll likely use advanced digital twins and simulation tools rather than traditional trial-and-error methods.
Why We Recommend This Job
- End-to-End Ownership: Unlike many offshore roles that only handle “back-office” CAD work, this is a Lead role with responsibility from initial concept to DO-160 certification and production.
- Critical Infrastructure: You are working on LRUs (Line Replaceable Units) which are the “brains” of the aircraft.
- Global Impact: Boeing products are used in 150+ countries; your designs will literally be flying across the globe for decades.
Career Growth Potential
From this Lead position, the natural trajectory is toward Senior Principal Engineer or Technical Fellow—Boeing’s highest rank for individual technical contributors. Alternatively, given the project management responsibilities, you could pivot into Engineering Management or Chief Engineer roles for specific aircraft programs.
Skills You’ll Gain
- DO-160 Expertise: Mastery of the “gold standard” for environmental testing in aerospace.
- Advanced Thermal Management: Designing cooling systems for next-gen high-power density electronics.
- System Integration: Learning how to harmonize mechanical constraints with ARINC/VITA electrical interface standards.
Salary & Benefits Info
- Estimated Salary: For a Lead role with 12+ years of experience in Bengaluru’s aerospace sector, the Total Compensation (TC) typically ranges from ₹35,00,000 to ₹55,00,000+ per annum, depending on the specific expertise in thermal/structural analysis.
- Relocation: Boeing offers a comprehensive relocation package for eligible candidates, making it easier to move to Bengaluru.
- Wellbeing: Boeing is noted for its “variable arrangements” and flexibility, supporting a healthier work-life balance compared to traditional manufacturing setups.
- Boeing Workforce Diversity Statistics
- Boeing provides detailed annual reports on their progress toward a more inclusive workforce. Based on their 2023-2024 data:
- Global Gender Representation: Women make up approximately 25.2% of Boeing’s global workforce.
- US Racial/Ethnic Diversity (Total Workforce):
- White: 61.6%
- Asian: 15.6%
- Black: 7.5%
- Hispanic/Latinx: 8.4%
- Native American/Other: 1.4%
- Hiring Trends: In recent years, Boeing has significantly increased the percentage of diverse hires, with 47.9% of all US hires in 2023 coming from underrepresented racial or ethnic groups.